A Micro-Metal Inserts Based Microchannel Heat Sink for Thermal Management of Densely Packed Semiconductor Systems

The thermal management of high-heat-density devices is essential for reliable operation. In this work, a novel procedure proposed and investigated the efficient such devices. introduces different arrangements metal inserts within cooling channel heat sink. objective those to form boundary layers prevent any hot spots from appearing flow increase temperature uniformity. Five are introduced numerically using commercial software package ANSYS FLUENT 2021R1. model was validated against previous findings showed good agreement with errors less than 5.5%. then used study transfer characteristics cases compared traditional straight channels under same operating conditions. All displayed better configuration studied range. They also exhibited lower nonuniformities, implying distribution. contours over source top surface streamlines introduced. Among all cases, microchannel micro insert located at wall along second row covering two-thirds bottom studied. This case achieved best highest uniformity, making it viable candidate high power density devices’ management.